FlexLink Systems has scheduled a press conference at Pack Expo International 2004 for Monday, November 8th at 3:30 p.m. to introduce the integration of FlexLink products into the packaging and conveying industry. The conference will take place in booth# 4650 in the North Hall of McCormick Place in Chicago followed by a brief question and answer session.  Press kits will be available at the booth.

PACK EXPO International 2004 will focus on the latest developments in packaging technology and will showcase exhibitors’ state-of-the-art advances in packaging machinery, converting machinery, materials, packages and containers, and components.  The exhibition will run from Sunday, November 7 thru Thursday, November 11, at the McCormick Place in Chicago.    

50,000 attendees are expected to attend, including over 6,000 international visitors from more than 75 countries. 
Pack Expo International takes place every two years at McCormick Place, Chicago, IL, USA.  

Visit FlexLink at booth #N-4650, North Building, Upper Level

FlexLink supplies complete packaging lines, including production logistic (conveyor) systems, integration of packaging machinery, automation (robot) cells for pick & place operations, software and integration of labelling and measuring machinery and equipment

FlexLink operates in packaging processes from medium to high volume production. The highest volumes are found within the food industry. Other areas of high volume are personal products and consumer electronics.

On display at Pack Expo International 2004:

• Visualization of an overhead conveyor featuring an alpine, wedge, and slide gate
• Paper diverter
• Classic hygienic, XMY, demo
• Classic modular, EM, demo   

See you at Pack Expo International 2004! 

Preregister at: us1.marketing@flexlink.com