Nepcon China is the largest electronics manufacturing exhibition in China and takes place annually at Shanghai Everbright Convention & Exhibition Centre. This year’s exhibition will be held April 12–15, and will cover latest technologies and emerging trends in assembly processes, software, design, test and production equipment for electronics manufacturing and design.

Visit FlexLink at booth #IJ55, West Hall, Level 1

FlexLink offers a wide range of assembly systems, from simple pallet based systems through to highly automated turnkey assembly and test systems. Our new generation PCB handling platform provides high quality, reliable solutions for a wide range of handling requirements.

FlexLink will introduce several new products for assembly automation and PCB handling at Nepcon China:
• DAS 30  is the latest development of our DAS (Dynamic Assembly System) product family, a re-configurable manufacturing system for products up to 30 kg, consisting of plug-and-play hardware and software modules. The new DAS 30 allows a high degree of flexibility in factory layout design, production control and step-by-step automation. 
• Laser marking cell  for high speed laser marking. The cell includes an integrated vision verification system and is designed to accommodate a multitude of different configurations to suit any applications and tolerance levels.
• PCB handling: F1000 Bare Board Destacker for introduction of PCB boards into the production line. The unit comes with a technically advanced releasing mechanism for board separation; E1400 Multi-Magazine Loader, an efficient, compact and cost effective loader for buffering of PC boards at the end of the production line; E2000 Edge Belt, a high quality and cost effective transport conveyor for handling of board buffering and transfer.

We look forward to seeing you at Nepcon China 2005!

Preregister at: info.sg@flexlink.com